English
SMT Basics
Surface Mount Technology, SMT, is called surface mount or surface mount technology. It is a circuit assembly technology to solder and assemble printed circuit board components without pins or short leads (SMC/SMD in Chinese) on the surface of PCB or other substrates by reflow soldering or dip soldering.
SMT Features
With high assembly density, small size and light weight of electronic products, the volume and weight of SMT components are only about 1/10 of those of traditional plug-in components. After SMT is generally used, the volume of electronic products is reduced by 40%~60%, and the weight is reduced by 60%~80%.
High reliability and strong seismic resistance. The solder joint defect rate is low.
High frequency characteristics are good. Reduce electromagnetic and radio frequency interference.
It is easy to realize automation and improve production efficiency. Reduce the cost by 30%~50%. Save materials, energy, equipment, manpower, time, etc.
SMT composition
In general, SMT includes surface mount technology, surface mount equipment, surface mount components and SMT management.
Why use SMT
The electronic products pursue miniaturization, and the previously used perforated plug-in components can no longer be reduced.
The functions of electronic products are more complete, and the integrated circuits (ICs) used are no longer equipped with perforated components, especially large-scale and highly integrated ICs, so surface mount components have to be used.
Mass production and production automation. The manufacturer should produce high-quality products at low cost and high output to meet customer needs and strengthen market competitiveness
The development of electronic components, the development of integrated circuits (ICs), and the multiple applications of semiconductor materials.
The revolution of electronic science and technology is imperative and follows the international trend.
